Ball grid array

<p>A ball grid array (BGA) is a type of <a href="/facts/Surface-mount/SjFyQbbm">surface-mount</a> packaging (a <a href="/facts/Chip_carrier/8Uwkvmws">chip carrier</a>) used for <a href="/facts/Integrated_circuit/fjn6vg7C">integrated circuits</a>. BGA packages are used to permanently mount devices such as <a href="/facts/Microprocessor/Fx9CaQht">microprocessors</a>. A BGA can provide more interconnection pins than can be put on a <a href="/facts/Dual_in-line_package/Qgu6Jave">dual in-line</a> or <a href="/facts/Quad_Flat_Package/B5FLpfqx">flat package</a>. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
</p><p>Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic <a href="/facts/Reflow_oven/cdP9Gk7Y">reflow ovens</a>.
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Ball grid array open-in-new

Ball grid array