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Thermal interface material
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<h2 id="see-also">See also</h2> <ul><li><a href="/facts/Heat_sink/ccIEdHnq">Heat sink</a></li> <li><a href="/facts/Heat_spreader/LnVok7d5">Heat spreader</a></li></ul> <h2 id="references">References</h2> <ol> <li id="fn:1"><p>Cui, Y.; Li, M.; Hu, Y. (2020). "Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities". Journal of Materials Chemistry C. 8 (31): 10568–10586. doi:10.1039/C9TC05415D. <a href="/wiki/Doi_(identifier)" target="_blank">/wiki/Doi_(identifier)</a> <a href="#fnref:1" class="footnote-back-ref">↩</a></p></li> <li id="fn:2"><p>Cui, Y.; Li, M.; Hu, Y. (2020). "Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities". Journal of Materials Chemistry C. 8 (31): 10568–10586. doi:10.1039/C9TC05415D. <a href="/wiki/Doi_(identifier)" target="_blank">/wiki/Doi_(identifier)</a> <a href="#fnref:2" class="footnote-back-ref">↩</a></p></li> <li id="fn:3"><p>Kearney, Andrew; Li, Li; Sanford, Sean (2009). "Interaction between TIM1 and TIM2 for mechanical robustness of integrated heat spreader". 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium. pp. 293–298. doi:10.1109/STHERM.2009.4810778. ISBN 978-1-4244-3664-4. S2CID 29501079. <a href="978-1-4244-3664-4" target="_blank">978-1-4244-3664-4</a> <a href="#fnref:3" class="footnote-back-ref">↩</a></p></li> <li id="fn:4"><p>Liu, Johan; Michel, Bruno; Rencz, Marta; Tantolin, Christian; Sarno, Claude; Miessner, Ralf; Schuett, Klaus-Volker; Tang, Xinhe; Demoustier, Sebastien (2008). "Recent progress of thermal interface material research - an overview". 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems. pp. 156–162. doi:10.1109/THERMINIC.2008.4669900. ISBN 978-1-4244-3365-0. S2CID 40595787. Retrieved 30 March 2023. <a href="978-1-4244-3365-0" target="_blank">978-1-4244-3365-0</a> <a href="#fnref:4" class="footnote-back-ref">↩</a></p></li> <li id="fn:5"><p>Bartlett, Michael; Kazem, Navid; Powell-Palm, MAtthew; Huang, Xiaonan; Sun, Wenhuan; Malen, Jonathan; Majidi, Carmel (2017). "High thermal conductivity in soft elastomers with elongated liquid metal inclusions". Proceedings of the National Academy of Sciences. 114 (9): 2143–2148. Bibcode:2017PNAS..114.2143B. doi:10.1073/pnas.1616377114. PMC 5338550. PMID 28193902. <a href="https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5338550" target="_blank">https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5338550</a> <a href="#fnref:5" class="footnote-back-ref">↩</a></p></li> <li id="fn:6"><p>Jarrtett, Robert N.; Ross, Jordan P.; Berntson, Ross (September 2007). "Full Metal TIMs". Power Systems Design Europe. <a href="#fnref:6" class="footnote-back-ref">↩</a></p></li> </ol>