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Single-Chip Module
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<h2 id="see-also">See also</h2> <ul><li><a href="/facts/System_in_a_package/Tqdpp6hq">System in a package</a> (SIP)</li> <li><a href="/facts/Hybrid_integrated_circuit/LbHBe5L3">Hybrid integrated circuit</a></li> <li><a href="/facts/Chip_carrier/8Uwkvmws">Chip carrier</a> Chip packaging and package types list</li> <li><a href="/facts/Multi-chip_module/AzyVaNNp">Multi-chip module</a> (MCM)</li></ul> <h2 id="references">References</h2> <ol> <li id="fn:1"><p>Lau, John H. (1994-06-30). Chip On Board: Technology for Multichip Modules. Springer Science & Business Media. ISBN 978-0-442-01441-4. <a href="978-0-442-01441-4" target="_blank">978-0-442-01441-4</a> <a href="#fnref:1" class="footnote-back-ref">↩</a></p></li> <li id="fn:2"><p>Einspruch, Norman G. (2014-12-01). VLSI Electronics: Microstructure Science. Academic Press. ISBN 978-1-4832-1772-7. <a href="978-1-4832-1772-7" target="_blank">978-1-4832-1772-7</a> <a href="#fnref:2" class="footnote-back-ref">↩</a></p></li> </ol>